Performs depth electrical and physical failure analysis for cutting edge products using non-destructive analytical tools (such as X-
ray, Scanning Acoustic Microscope (SAM), and Optical microscopes), electrical bench verification tools and datalog interpretations, circuit schematics interpretation, fault isolation techniques (such as Photo Emission Microscope (PEM), Liquid Crystal Analysis (LCA), Optical Beam-
Induced Resistance Change (OBIRCH), and die level microprobing), deliding / delayering techniques (such as chemical and laser decapsulation, chemical etch, dry etch, mechanical etch, or combination of different etches), and SEM / EDX analysis.
Handles more complex cases and mentors for junior engineers / technicians
Acts as Officer-in-Charge (OIC) in managers’ absence.
Works with fellow engineers both local and other Failure Analysis engineering counterparts from different Microchip sites to develop failure analysis techniques and capabilities.
Works with Applications, Customer Quality, Product, Test, Fab, Assembly, and Design Engineering if any help needed to resolve product FA-related issues.
Generates comprehensive failure Analysis Report based on analysis findings.
Develops and implements new failure analysis methods / techniques and capabilities.
Proficient in electronic / electrical circuit and material analysis.
Ability to effectively extract, analyze, and report data as necessary.
Efficient computer skills (MS Word, MS Access, PowerPoint, and Excel).
Woks well in a fast paced environment with capability to interface throughout all levels and functions of the organization as a team player with little or no supervision.
Excellence knowledge of tools and methods related to inspection and analysis of components of both package and die form in semiconductor industry environment.
Good interpersonal and communication skills (verbal and written) with the capability to interface throughout all levels and functions.
The ability to manage time and priorities effectively.
Experienced in Failure Analysis laboratory processes and equipment’s is an advantage.
Working knowledge of statistical process control and experiment design concepts is also an advantage.
Preferably Graduate of any of the following courses : BS EcE / MSEcE, BSEE / MSEE, BS Physics, BS Chemistry, BS Chemical Engg, BS Metallurgical Engg, or BS Material Science.
Minimum of Fifteen (15) years and above relevant work experience in semiconductor manufacturing environment.