Communications Partner - To support daily communication between Bosch Reutingen and subcontractors on technical subjects.
Logistics and Delivery - To provide technical support in the case of technical constraints causing delivery problems, capacity bottlenecks, etc.
Documentation - For the Product-defining documents Detailed device specification , to check that the up-to-date copies are correctly archived by the subcontractor.
Quality - To check and audit adherence of the production lines to Bosch requirements, especially Customer Process Flow, Process Control Plan, Machine qualification, SPC, Machine Logbooks, OCAP’s (Output Control Action Plans), etc.
Engineering - To monitor process and equipment changes, line or equipment moves, etc as defined in the Bosch documents General Specification for Packaging .
Graduate of any Engineering course or equivalent.
Preferably with 7 years and above experience in Semiconductor Industry.
With knowledge and skills in EOL assemble handling, BGA, QFN, LGA, MEMS packages, FOL, EOL assembly, FMEA, SPC, and 8d.
With knowledge in wire and die bond processes.
With project management skills.
With problem solving abilities.
With ability to work with minimum supervision.
Kindly attach your resume in your application. Only shortlisted candidates will be contacted.