Microchip Technology Inc. is a leading provider of embedded control applications. Our product portfolio comprises general purpose and specialized 8-bit, 16-bit, and 32-bit microcontrollers, 32-bit microprocessors, field-programmable gate array (FPGA) products, a broad spectrum of high-performance linear, mixed-signal, power management, thermal management, radio frequency (RF), timing, safety, security, wired connectivity and wireless connectivity devices, as well as serial Electrically Erasable Programmable Read Only Memory (EEPROM), Serial Flash memories, Parallel Flash memories, and serial Static Random Access Memory (SRAM).
We also license Flash-IP solutions that are incorporated in a broad range of products.
Responsible in reviewing and establishing activities to determine final disposition on Assembly subcon Proposal Change Notice (PCN).
Responsible in establishing qualification plan for internally driven change on production devices to accomplish Microchip organizational and business objectives.
Responsible for leading and managing qualification activities to ensure process is in control and quality / reliability of products meets expectation.
Able to establish qualification plan and presenting qualification proposal to internal Microchip Change Control board.
Able to drive problem resolution using systematic approach on qualification failures.
Able to work together with subcon and Microchip functional groups locally / globally.
At least 5 years experienced in IC assembly Process Engineering.
Knowledgeable in WLCSP packaging and experience in package qualification activities is an advantage.
Knowledgeable in MS (eg. xls, ppt, word) application, MS Excel macro level analysis (eg. pivot table, vlookup function, etc) is an advantage.
analytical knowhow on IC packaging process and materials and familiar with JEDEC Standard and requirements on IC Packaging technology
Knowledge and use of CAD tools an advantage
Bachelor’s degree in Engineering