Senior Package Architect
3d ago

What you will do

  • Support Technology and Package development and Qualification, focusing on new Silicon (Trench), GaN , SiC technologies
  • Support Capability Studies, Business Group Initiated Projects, and Site initiated projects.
  • Perform Design for Manufacturability FMEA
  • Compile, analyze development data, provide recommendations.
  • Present in Technical Review Board
  • Write Technical Reports, Technical Papers and publish to Technology groups
  • Lead / participate Cross Site Package Architect group activities
  • Present in Technical Forums
  • Submit Invention Disclosures and Patents
  • What you will need

  • Degree / Master in Engineering / Material Sciences related or equivalent.
  • 5 years’ experience in for semiconductor packaging. In-depth knowledge of IC / Power packaging is highly desired.
  • Working experience with AutoCAD, ANSYS Workbench is a plus
  • Broad knowledge of various material types such as silicon, compound, and metals (e.g., solder) and their material behaviors is required.
  • Good understanding of general semiconductor packaging processes, materials, technology and trends, such as leadframe , clip design and manufacturing, molding, die attach, etc.
  • Strong oral and written communication skills
  • Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development
  • Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia® is a registered trademark.

    Nexperia is an Equal Opportunity / Affirmative Action Employer.

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