Engineering Technical Operator
ON Semiconductor
2d ago


Perform in-process quality monitoring using different test metrologies : Ball Shear, Wire Pull, Die shear, Cratering Test, and Die Strength Test

Perform heater block temperature profiling on all wire bond machines

Perform functional line test (FLT) of direct materials

Support process characterization, optimization studies, and evaluations of different measurement using HISOMET Toolmaker such as Loop Height, Ball Size, Die Thickness, Bond Pad Opening, Bond Line Thickness, Free Air Ball, X-ray and other engineering responses

Provide support in Qualification of New Equipment, Products and Processes

Perform saw to wire bond process, as needed for engineering evaluations

Ensure availability of complete Total Control Methodology (TCM) packages on all machines

Conduct regular audit on the process controls as defined by Process Engineers


Graduate of a Technical Course

Must know the process flow and basic operation of machines

Flexible and must have a sense of responsibility, aggressiveness, and initiative

Familiar with the safety precautions of the equipment

With effective decision-making skills

Can perform the job with minimal supervision

Proficient in MS Office Applications

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